Patent Assignment
Reel/Frame 053193/0338
Assignment of Assignor's Interest
Recorded: 2020-07-13
Pages: 7
Assignors
NICHOLLS, LOUIS W.
Executed: 2012-04-18
ST. AMAND, ROGER D.
Executed: 2012-04-19
KIM, JIN SEONG
Executed: 2012-04-19
JUNG, WOON KAB
Executed: 2012-04-19
YANG, SUNG JIN
Executed: 2012-04-17
DARVEAUX, ROBERT F.
Executed: 2012-04-18
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Methods and Structures for Increasing the Allowable Die Size in Tmv Packages
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Second Inventor's Execution Date Previously Recorded at Reel: 053193 Frame: 0338. Assignor(S) Hereby Confirms the Assignment .
Jul 20, 2020
From: NICHOLLS, LOUIS W.; ST. AMAND, ROGER D.; KIM, JIN SEONG; JUNG, WOON KAB
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 053258/0524 →
Assignment of Assignor's Interest
Oct 22, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 054179/0524 →