Patent Assignment
Reel/Frame 053194/0288
Assignment of Assignor's Interest
Recorded: 2020-07-13
Pages: 2
Assignors
HUANG, WEN-SHEH
Executed: 2020-06-29
CHEN, YU-HSIANG
Executed: 2020-06-29
CHEN, CHII-PING
Executed: 2020-06-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Thermal Dissipation in Semiconductor Devices