Patent Assignment
Reel/Frame 053198/0538
Assignment of Assignor's Interest
Recorded: 2020-07-14
Pages: 5
Assignors
JEONG, EUNYOUNG
Executed: 2020-06-23
LEE, JUIK
Executed: 2020-06-04
HAN, JUNGHOON
Executed: 2020-06-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Formed Using a Cover Insulation Layer and Semiconductor Package Including the Same