Patent Assignment
Reel/Frame 053208/0770
Assignment of Assignor's Interest
Recorded: 2020-07-14
Pages: 5
Assignors
HUANG, CHIA HSIU
Executed: 2020-07-09
CHEN, CHUN CHEN
Executed: 2020-07-09
CHO, WEI CHIH
Executed: 2020-07-09
YANG, SHAO-LUN
Executed: 2020-07-10
HSIEH, YU-SHUN
Executed: 2020-07-09
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Lead Frame, Package Structure Comprising the Same and Method for Manufacturing the Package Structure