Patent Assignment
Reel/Frame 053209/0193
Assignment of Assignor's Interest
Recorded: 2020-07-14
Pages: 4
Assignors
TSAI, TSUNG-FU
Executed: 2020-06-09
KAO, CHIN-FU
Executed: 2020-06-09
WANG, PU
Executed: 2020-06-09
LU, SZU-WEI
Executed: 2020-06-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Fabricating the Same