Assignment of Assignor's Interest

Recorded: 2020-07-15 Pages: 3

Assignor

Executed: 2020-06-22

Assignee

MITSUBISHI ELECTRIC CORPORATION

7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN

Covered Property (1)

Method for Estimating Degradation of a Wire-Bonded Power Semi-Conductor Module

Patent: 11,474,146 →

Application: 16/962,130 →

Publication: US 2020/0408830

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.