Patent Assignment
Reel/Frame 053217/0856
Assignment of Assignor's Interest
Recorded: 2020-07-15
Pages: 2
Assignors
CHEN, MING-FA
Executed: 2020-07-01
YEH, SUNG-FENG
Executed: 2020-07-01
CHEN, HSIEN-WEI
Executed: 2020-07-01
CHEN, JIE
Executed: 2020-07-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bond Pad Structure for Semiconductor Device and Method of Forming Same