Assignment of Assignor's Interest

Recorded: 2020-07-16 Pages: 4

Assignors

FUKUOKA, TOMOHISA

Executed: 2020-05-25

TAKAHASHI, TETSUHIRO

Executed: 2020-05-22

OHI, AKINORI

Executed: 2020-05-28

Assignee

TDK CORPORATION

2-5-1, NIHONBASHI, CHUO-KU, TOKYO, 103-6128, JAPAN

Covered Property (1)

Multilayer Electronic Component and Mounting Structure Thereof

Patent: 10,825,611 →

Application: 16/930,668 →