Patent Assignment
Reel/Frame 053232/0780
Assignment of Assignor's Interest
Recorded: 2020-07-16
Pages: 2
Assignors
CHEN, MING-FA
Executed: 2020-06-30
CHEN, HSIEN-WEI
Executed: 2020-06-19
CHEN, YING-JU
Executed: 2020-06-19
CHEN, JIE
Executed: 2020-06-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Method for Forming Integrated High Density Mim Capacitor