Patent Assignment
Reel/Frame 053238/0142
Assignment of Assignor's Interest
Recorded: 2020-07-17
Pages: 2
Assignor
KAWADAHARA, SHO
Executed: 2020-07-15
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, 108-0023, JAPAN
Covered Property
(1)
Wafer Separating Method