Patent Assignment
Reel/Frame 053244/0479
Assignment of Assignor's Interest
Recorded: 2020-07-17
Pages: 4
Assignors
HUNG, YI-TSE
Executed: 2020-07-08
CHENG, CHAO-CHING
Executed: 2020-07-08
CHEN, TSE-AN
Executed: 2020-07-08
CHIANG, HUNG-LI
Executed: 2020-07-08
LI, LAIN-JONG
Executed: 2020-07-08
CHEN, TZU-CHIANG
Executed: 2020-07-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Low Dimensional Material Device and Method