Patent Assignment
Reel/Frame 053246/0894
Assignment of Assignor's Interest
Recorded: 2020-07-18
Pages: 7
Assignors
KIM, EUNJI
Executed: 2020-01-09
CHO, SUNGDONG
Executed: 2020-01-10
PARK, KWANGWUK
Executed: 2020-01-09
PARK, SANGJUN
Executed: 2020-01-10
LEE, DAESUK
Executed: 2020-01-10
LEE, HAKSEUNG
Executed: 2020-01-10
Assignee
SAMSUNG ELECTRONICS CO, LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including via Structure with Head and Body Portions