Patent Assignment
Reel/Frame 053248/0764
Assignment of Assignor's Interest
Recorded: 2020-07-20
Pages: 2
Assignors
WU, JIUN YI
Executed: 2020-07-01
YU, CHEN-HUA
Executed: 2020-06-30
LIU, CHUNG-SHI
Executed: 2020-06-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method