Patent Assignment
Reel/Frame 053257/0646
Assignment of Assignor's Interest
Recorded: 2020-07-20
Pages: 3
Assignors
CHEN, CHEN-SHIEN
Executed: 2020-06-21
CHENG, MING-DA
Executed: 2020-06-15
YEW, MING-CHIH
Executed: 2020-04-22
SU, YU-TSE
Executed: 2020-06-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package and Method for Manufacturing the Same