IP Library › Assignment 053264/0421
Patent Assignment
Reel/Frame 053264/0421

Assignment of Assignor's Interest

Recorded: 2020-07-21 Pages: 3
Assignors
JEONG, JIN WON
Executed: 2020-07-13
CHOI, JAE SIK
Executed: 2020-07-13
SONG, BYEUNG SOO
Executed: 2020-07-13
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO, CHEONGJU-SI, 28429, KOREA, REPUBLIC OF
Covered Property (1)
Fabrication Method of Semiconductor Die and Chip-on-Plastic Packaging of Semiconductor Die
Application: 16/934,338 →
Publication: US 2021/0296271
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Mar 14, 2024
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: MAGNACHIP MIXED-SIGNAL, LTD.
Reel/Frame 066878/0875 →
Assignment of Assignor's Interest Jul 7, 2025
From: MAGNACHIP MIXED-SIGNAL, LTD.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 071813/0800 →