Patent Assignment
Reel/Frame 053275/0155
Assignment of Assignor's Interest
Recorded: 2020-07-22
Pages: 2
Assignors
JENG, SHIN-PUU
Executed: 2020-05-21
CHUANG, PO-YAO
Executed: 2020-05-21
CHEN, SHUO-MAO
Executed: 2020-05-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Packages Including Passive Devices and Methods of Forming Same