Patent Assignment
Reel/Frame 053282/0524
Assignment of Assignor's Interest
Recorded: 2020-07-22
Pages: 4
Assignor
OTSUKA, YOSHITAKA
Executed: 2020-07-22
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Bonding System and Bonding Method