Patent Assignment
Reel/Frame 053290/0703
Assignment of Assignor's Interest
Recorded: 2020-07-23
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2020-07-15
LIN, YUNG-CHI
Executed: 2020-07-14
CHIOU, WEN-CHIH
Executed: 2020-07-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method