IP Library Assignment 053291/0868
Patent Assignment
Reel/Frame 053291/0868

Assignment of Assignor's Interest

Recorded: 2020-07-23 Pages: 4
Assignors
PAN, YING-CHIEH
Executed: 2020-03-30
LU, HSIANG-HUA
Executed: 2020-03-30
NI, CHING-YU
Executed: 2020-03-30
Assignee
SOCLE TECHNOLOGY CORP.
3F, NO.1, INNOVATION ROAD II, HSINCHU SCIENCE PARK,HSINCHU 30076, TAIWAN R.O.C, HSINCHU, TAIWAN
Covered Property (1)
Fan-Out Packaging Structure and Method of Making Same
Application: 16/936,721 →
Publication: US 2021/0134732
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 18, 2022
From: SOCLE TECHNOLOGY CORP.
To: KORE SEMICONDUCTOR CO., LTD.
Reel/Frame 059300/0894 →