Patent Assignment
Reel/Frame 053311/0163
Assignment of Assignor's Interest
Recorded: 2020-07-24
Pages: 6
Assignee
IOWA STATE UNIVERSITY RESEARCH FOUNDATION, INC.
1805 COLLABORATION PLACE, SUITE 2100, AMES, IOWA, 50010
Covered Property
(1)
Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.