Patent Assignment
Reel/Frame 053314/0920
Assignment of Assignor's Interest
Recorded: 2020-07-27
Pages: 6
Assignors
TAKAHASHI, TOMONORI
Executed: 2020-05-19
SUGIMURA, NOBUAKI
Executed: 2020-05-19
SEKI, HIROYUKI
Executed: 2020-05-18
Assignee
FUJIFILM CORPORATION
26-30, NISHIAZABU 2-CHOME, MINATO-KU, TOKYO, 106-8620, JAPAN
Covered Property
(1)
Method for Treating Substrate, Method for Manufacturing Semiconductor Device, and Kit for Treating Substrate