Patent Assignment
Reel/Frame 053316/0088
Assignment of Assignor's Interest
Recorded: 2020-07-27
Pages: 6
Assignors
FRISCH, HENRY
Executed: 2020-03-03
ANGELICO, EVAN
Executed: 2020-03-03
ELAGIN, ANDREY
Executed: 2020-03-04
SPIEGLAN, ERIC
Executed: 2020-03-03
Assignee
THE UNIVERSITY OF CHICAGO
5801 SOUTH ELLIS AVENUE, CHICAGO, ILLINOIS, 60637
Covered Property
(1)
Methods of Fabricating Vacuum Housings with Hermetic Solder Seals Using Capillary Solder Wicks
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.