Patent Assignment
Reel/Frame 053318/0244
Assignment of Assignor's Interest
Recorded: 2020-07-27
Pages: 3
Assignor
SHINKAI, HIROYUKI
Executed: 2020-07-20
Assignee
ROHM CO., LTD.
21 SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO, 615-8585, JAPAN
Covered Property
(1)
Semiconductor Device for Reducing Concentration of Thermal Stress Acting on Bonding Layers