Patent Assignment
Reel/Frame 053318/0397
Assignment of Assignor's Interest
Recorded: 2020-07-27
Pages: 2
Assignor
KAWAI, SATORU
Executed: 2020-07-27
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Printed Wiring Board and Method for Manufacturing Printed Wiring Board