Patent Assignment
Reel/Frame 053319/0245
Assignment of Assignor's Interest
Recorded: 2020-07-27
Pages: 6
Assignors
JUN, JOONHO
Executed: 2020-06-01
KANG, UN-BYOUNG
Executed: 2020-06-01
SEO, SUNKYOUNG
Executed: 2020-06-01
LEE, JONGHO
Executed: 2020-06-01
JEE, YOUNG KUN
Executed: 2020-06-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Including Stacked Substrates and Penetration Electrodes