Patent Assignment
Reel/Frame 053321/0801
Assignment of Assignor's Interest
Recorded: 2020-07-27
Pages: 13
Assignors
GROOTHUIS, STEVEN K.
Executed: 2012-08-20
LI, JIAN
Executed: 2012-08-16
ZHANG, HAOJUN
Executed: 2012-08-16
SILVESTRI, PAUL A.
Executed: 2012-08-29
LI, XIAO
Executed: 2012-08-20
LUO, SHIJIAN
Executed: 2012-08-15
ENGLAND, LUKE G.
Executed: 2012-08-22
KEETH, BRENT
Executed: 2012-08-15
GANDHI, JASPREET S.
Executed: 2012-08-15
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Stacked Semiconductor Die Assemblies with Multiple Thermal Paths and Associated Systems and Methods