Patent Assignment
Reel/Frame 053323/0670
Assignment of Assignor's Interest
Recorded: 2020-07-28
Pages: 4
Assignor
IKEDA, NORIAKI
Executed: 2020-07-28
Assignee
WINBOND ELECTRONICS CORP.
NO. 8 KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK,, TAICHUNG CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof
Patent:
11,056,175 →
Application:
16/940,411 →