Patent Assignment
Reel/Frame 053331/0453
Assignment of Assignor's Interest
Recorded: 2020-07-28
Pages: 4
Assignor
HERRAULT, FLORIAN G.
Executed: 2020-01-09
Assignee
HRL LABORATORIES, LLC
3011 MALIBU CANYON ROAD, MALIBU, CALIFORNIA, 90265
Covered Properties
(2)
Method to Protect Die During Metal-Embedded Chip Assembly (Meca) Process
Patent:
11,158,520 →
Application:
16/739,001 →
Publication:
US 2020/0294816
PCT:
PCT/US2020/012988 ↗
Method to Protect Die During Metal-Embedded Chip Assembly (MECA) Process
Application:
62/816,839 →