IP Library › Assignment 053331/0457
Patent Assignment
Reel/Frame 053331/0457

Assignment of Assignor's Interest

Recorded: 2020-07-28 Pages: 3
Assignors
MALDO, TIBURCIO
Executed: 2018-03-29
LEE, KEUNHYUK
Executed: 2018-03-29
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Leadframe with Sockets for Solderless Pins
Application: 16/947,317 →
Publication: US 2020/0365493
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Nov 25, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054523/0378 →
Release of Security Interest in Patents Previously Recorded at Reel 054523, Frame 0378 Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0602 →