Patent Assignment
Reel/Frame 053334/0523
Assignment of Assignor's Interest
Recorded: 2020-07-28
Pages: 5
Assignors
CHEN, CHIH-HAO
Executed: 2020-05-20
KAO, CHIN-FU
Executed: 2020-05-20
CHENG, LI-HUI
Executed: 2020-05-20
LU, SZU-WEI
Executed: 2020-05-20
PAN, CHIH-CHIEN
Executed: 2020-05-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
An Adhesive and Thermal Interface Material on a Plurality of Dies Covered by a Lid