Patent Assignment
Reel/Frame 053344/0839
Assignment of Assignor's Interest
Recorded: 2020-07-29
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bump Joint Structure with Distortion and Method Forming Same