Patent Assignment
Reel/Frame 053345/0723
Assignment of Assignor's Interest
Recorded: 2020-07-29
Pages: 6
Assignors
HONG, WOORAM
Executed: 2020-06-30
KIM, JEONGHUN
Executed: 2020-06-30
CHOI, HYUNDO
Executed: 2020-06-30
KWON, HYUKJU
Executed: 2020-06-30
PARK, YOUNGJIN
Executed: 2020-06-30
JEON, ARAM
Executed: 2020-06-30
JUNG, YONGSIK
Executed: 2020-06-30
CHOI, WONJE
Executed: 2020-06-30
HA, TAESIN
Executed: 2020-06-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Heat Exchanger Module, Assembly-Type Heat Exchanger Including Heat Exchanger Module, and Heat Exchanger Assembly System