Patent Assignment
Reel/Frame 053347/0780
Assignment of Assignor's Interest
Recorded: 2020-07-29
Pages: 6
Assignors
LAM, WING KEUNG
Executed: 2020-07-23
SIRINORAKUL, SARAVUTH
Executed: 2020-07-23
LOCK, KOK CHUEN
Executed: 2020-07-29
ROBLES, ROEL ADEVA
Executed: 2020-07-29
Assignee
UTAC HEADQUARTERS PTE. LTD.
22 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569506, SINGAPORE
Covered Property
(1)
Stacked Dies Electrically Connected to a Package Substrate by Lead Terminals