IP Library Assignment 053352/0598
Patent Assignment
Reel/Frame 053352/0598

Assignment of Assignor's Interest

Recorded: 2020-07-30 Pages: 12
Assignors
MALEKI, MILAD
Executed: 2020-07-23
FISCHER, FABIAN
Executed: 2020-07-20
TRÜSSEL, DOMINIK
Executed: 2020-07-28
GUILLEMIN, REMI-ALAIN
Executed: 2020-07-17
SCHNEIDER, DANIEL
Executed: 2020-07-21
Assignee
ABB SCHWEIZ AG
BRUGGERSTRASSE 66, BADEN, 5400, SWITZERLAND
Covered Property (1)
Power Semiconductor Module with Dimples in Metallization Layer Below Foot of Terminal
Application: 16/737,356 →
Publication: US 2020/0144188
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 15, 2021
From: ABB SCHWEIZ AG
To: ABB POWER GRIDS SWITZERLAND AG
Reel/Frame 055585/0670 →
Change of Name Dec 31, 2021
From: ABB POWER GRIDS SWITZERLAND AG
To: HITACHI ENERGY SWITZERLAND AG
Reel/Frame 058666/0540 →
Merger Nov 13, 2023
From: HITACHI ENERGY SWITZERLAND AG
To: HITACHI ENERGY LTD
Reel/Frame 065548/0905 →