Patent Assignment
Reel/Frame 053361/0552
Assignment of Assignor's Interest
Recorded: 2020-07-30
Pages: 6
Assignors
HUANG, KUAN-YU
Executed: 2020-07-16
WU, CHIH-WEI
Executed: 2020-07-17
HUANG, SUNG-HUI
Executed: 2020-07-16
HOU, SHANG-YUN
Executed: 2020-07-16
SHIH, YING-CHING
Executed: 2020-07-16
LI, CHENG-CHIEH
Executed: 2020-07-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Joint Structure in Semiconductor Package and Manufacturing Method Thereof