Patent Assignment
Reel/Frame 053368/0272
Assignment of Assignor's Interest
Recorded: 2020-07-31
Pages: 8
Assignors
YONEDA, YOSHIHIRO
Executed: 2020-05-29
HOSOI, TOSHIHIRO
Executed: 2020-06-01
FUKUDA, KENSHIRO
Executed: 2020-06-01
MATSUSHIMA, TOSHIFUMI
Executed: 2020-05-28
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property
(1)
Resin Composition, Copper Foil with Resin, Dielectric Layer, Copper-Clad Laminate, Capacitor Element, and Printed Wiring Board with Built-in Capacitor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.