IP Library › Assignment 053371/0376
Patent Assignment
Reel/Frame 053371/0376

Merger

Recorded: 2020-07-31 Pages: 33
Assignor
HOYA CANDEO OPTRONICS CORPORATION
Executed: 2020-01-01
Assignee
HOYA CORPORATION
6 CHOME 10-1, NISHISHINJUKU, SHINJUKU-KU, TOKYO, 160-8347, JAPAN
Covered Properties (4)
Circuit Board Supporting Structure and Light Emitting Device Having the Same
Application: 16/579,267 →
Publication: US 2020/0214133
Heat Dissipation Device and Light Irradiation Device Having Same
Application: 16/752,540 →
Publication: US 2020/0240716
Circuit Board Fixing Structure and Light Irradiation Device Having Same
Application: 16/775,232 →
Publication: US 2020/0244024
Light Guide Plate Made of Lead-Free Glass Having a High Refractive Index and Image Display Device Using a Light Guide Plate
Application: 16/801,106 →
Publication: US 2020/0218073
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 23, 2019
From: WATANABE, HIROAKI
To: HOYA CANDEO OPTRONICS CORPORATION
Reel/Frame 050463/0829 →
Assignment of Assignor's Interest Feb 25, 2020
From: KOGURE, YASUO
To: HOYA CANDEO OPTRONICS CORPORATION
Reel/Frame 051927/0233 →
Assignment of Assignor's Interest Apr 2, 2020
From: WATANABE, HIROAKI
To: HOYA CANDEO OPTRONICS CORPORATION
Reel/Frame 052294/0951 →
Assignment of Assignor's Interest Apr 16, 2020
From: WATANABE, HIROAKI; ASHIDA, KATSUMI
To: HOYA CANDEO OPTRONICS CORPORATION
Reel/Frame 052416/0430 →