Patent Assignment
Reel/Frame 053388/0792
Assignment of Assignor's Interest
Recorded: 2020-08-04
Pages: 4
Assignors
DAI, JIA-HONG
Executed: 2020-07-30
CHEN, JING-WEI
Executed: 2020-07-30
CHEN, JHIH-TONG
Executed: 2020-07-30
HOU, KAI-LUN
Executed: 2020-07-30
TSAI, TE-YING
Executed: 2020-07-30
Assignee
CORETRONIC CORPORATION
NO. 11, LI-HSIN RD., HSINCHU SCIENCE PARK,, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Heat Dissipating Module and Projection Device