Patent Assignment
Reel/Frame 053397/0768
Assignment of Assignor's Interest
Recorded: 2020-08-04
Pages: 6
Assignors
TRUHITTE, DARRELL D.
Executed: 2017-01-25
WANG, SOON WEI
Executed: 2017-01-25
CHEW, CHEE HIONG
Executed: 2017-01-25
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Leadless Semiconductor Packages, Leadframes Therefor, and Methods of Making
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 25, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054523/0378 →
Release of Security Interest in Patents Previously Recorded at Reel 054523, Frame 0378
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0602 →