Patent Assignment
Reel/Frame 053421/0054
Assignment of Assignor's Interest
Recorded: 2020-08-06
Pages: 6
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Modeling High Speed Channel in Semiconductor Package, Method of Designing Semiconductor Package Using the Same and Method of Manufacturing Semiconductor Package Using the Same