Patent Assignment
Reel/Frame 053426/0526
Assignment of Assignor's Interest
Recorded: 2020-08-07
Pages: 4
Assignors
CHEAH, BOK ENG
Executed: 2020-06-04
POH, YANG LIANG
Executed: 2020-06-05
OOI, KOOI CHI
Executed: 2020-06-04
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Vertical Die-to-Die Interconnects Bridge