Patent Assignment
Reel/Frame 053437/0119
Assignment of Assignor's Interest
Recorded: 2020-08-07
Pages: 3
Assignor
HABA, BELGACEM
Executed: 2020-08-04
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Integrated Device Packages with Integrated Device Die and Dummy Element
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Oct 31, 2022
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 061824/0324 →
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →