Patent Assignment
Reel/Frame 053438/0725
Assignment of Assignor's Interest
Recorded: 2020-08-08
Pages: 4
Assignors
TIEN, HSI-WEN
Executed: 2017-12-08
LIAO, WEI-HAO
Executed: 2017-12-08
LU, CHIH-WEI
Executed: 2017-12-08
DAI, PIN-REN
Executed: 2017-12-08
LEE, CHUNG-JU
Executed: 2017-12-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Interconnect Structure