Patent Assignment
Reel/Frame 053443/0615
Assignment of Assignor's Interest
Recorded: 2020-08-10
Pages: 4
Assignors
KWON, OHHYUCK
Executed: 2020-07-14
PARK, MIN
Executed: 2020-07-15
HUH, JAEYOUNG
Executed: 2020-07-14
KANG, DAESUK
Executed: 2020-07-14
EOM, JI
Executed: 2020-07-14
JEONG, EWIDON
Executed: 2020-07-14
PARK, SUNGCHUL
Executed: 2020-07-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Including Composite Heat Dissipation Member and Method of Manufacturing the Same