Patent Assignment
Reel/Frame 053447/0769
Assignment of Assignor's Interest
Recorded: 2020-08-10
Pages: 7
Assignors
HONG, JISEOK
Executed: 2020-07-06
KANG, UNBYOUNG
Executed: 2020-06-09
KANG, MYUNGSUNG
Executed: 2020-07-06
KIM, TAEHUN
Executed: 2020-07-06
PARK, SANGCHEON
Executed: 2020-07-06
LEE, HYUEKJAE
Executed: 2020-07-06
HWANG, JIHWAN
Executed: 2020-06-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Die-To-Wafer Bonding Structure and Semiconductor Package Using the Same