IP Library › Assignment 053464/0231
Patent Assignment
Reel/Frame 053464/0231

Assingment of Assignor's Interest

Recorded: 2020-08-11 Pages: 12
Assignor
HITACHI KOKUSAI ELECTRIC INC.
Executed: 2018-12-05
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property (1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Baffle Structure of the Substrate Processing Apparatus
Application: 16/987,073 →
Publication: US 2020/0381221
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 11, 2020
From: YANAI, HIDEHIRO; HIYAMA, SHIN; KAKUDA, TORU; SHIMADA, TOSHIYA
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 053461/0090 →