Patent Assignment
Reel/Frame 053470/0256
Assignment of Assignor's Interest
Recorded: 2020-08-12
Pages: 7
Assignors
CHAE, SEUNGHUN
Executed: 2020-05-04
SEO, YOUNGKWAN
Executed: 2020-05-04
LEE, JAEEAN
Executed: 2020-05-12
MOON, SOYEON
Executed: 2020-05-12
JO, HYEYEONG
Executed: 2020-05-07
SEO, ILJONG
Executed: 2020-05-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same