Patent Assignment
Reel/Frame 053484/0902
Assignment of Assignor's Interest
Recorded: 2020-08-13
Pages: 2
Assignor
SHIGETOSHI, TAKUSHI
Executed: 2020-08-05
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 2430014, JAPAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method of Semiconductor Device Including a Through Electrode for Connection of Wirings