Patent Assignment
Reel/Frame 053487/0432
Assignment of Assignor's Interest
Recorded: 2020-08-13
Pages: 4
Assignors
CHANG, YUNG-SHUN
Executed: 2019-11-26
LEE, TECK-CHONG
Executed: 2019-11-26
YANG, SHENG-WEN
Executed: 2019-11-26
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method for Packaging the Same