Patent Assignment
Reel/Frame 053493/0069
Assignment of Assignor's Interest
Recorded: 2020-08-14
Pages: 8
Assignors
ONG, JENNY SHIO YIN
Executed: 2020-05-29
LIM, SEOK LING
Executed: 2020-05-29
CHEAH, BOK ENG
Executed: 2020-05-29
KONG, JACKSON CHUNG PENG
Executed: 2020-05-28
SETHURAMAN, SARAVANAN
Executed: 2020-05-30
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Interposer Structures and Methods for 2.5D and 3D Packaging